Micron will build the facility within the compound of its Hiroshima plant, starting in May, with plans to launch HBM shipments around 2028, Nikkei said. The Ministry of Economy, Trade and Industry will subsidise up to JPY500 billion of the costs for the project, the newspaper said.
Japan has set aside about JPY5.7 trillion so far in a plan initiated in 2021 to rebuild the nation’s chipmaking prowess. In addition to Micron’s plant, it has also been allocating sums to projects from companies including global foundry giant Taiwan Semiconductor Manufacturing Co (TSMC) and home-grown Rapidus Corp.
Micron is competing in HBM against South Korea’s SK Hynix Inc and Samsung Electronics Co. Demand for the chips has surged from tech firms like OpenAI and Meta Platforms Inc as they focus on training and operating AI services.
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