Singapore’s Agency for Science, Technology and Research (A*STAR) has announced the launch of the world's first industry-grade 200 millimetre silicon carbide open research and development (R&D) line to enable and accelerate silicon carbide (SiC) innovation.
Launched under A*STAR’s Institute of Microelectronics (IME) arm, the open R&D line addresses key challenges faced in the development of SiC devices and increases the speed of R&D by eliminating fragmented processes that previously required researchers and companies to work with multiple facilities.
The announcement was made at this year’s Semicon Southeast Asia 2025 (SEMICON SEA), back for its 30th edition, with the three-day event featuring over 1,400 booths from 700 local and international exhibitors under the theme of ‘Strong together – collaborating to navigate uncertainties and fostering resilience’.
The semiconductor industry, increasingly so, is a key sector under the glare of governments and businesses in a contest of not just technology but also international politics, and Southeast Asia, with a deep role within the global supply chain of this industry, is finding new angles to this growth industry.
According to a 2025 report by internationalisation strategy consulting firm, EAC Consulting, Southeast Asia accounted for one-fifth of global chip exports in 2023. And within which, Singapore plays a key role. “Today, we account for one in 10 chips and one in five chipmaking equipment globally,” says Minister of Manpower, Dr Tan See Leng, at the opening ceremony of the conference.
However, Dr Tan warns that the recent geopolitical climate has hampered the economic rationale on which the global semiconductor supply chain has been built on, such as unilateral export restrictions being imposed on advanced chips and related manufacturing equipment.
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This, he says, has been a cause for anxiety amongst companies, who are uncertain about the implications on demand and potential supply chain disruptions.
“Given this operating context, Singapore will carry on with our work to strengthen existing partnerships and forge new alliances in two key areas. First, we will deepen integration with like-minded countries. Second, we will work closely with industry to prepare for growth through continued innovation and workforce development,” says Dr Tan.
Lab-in-Fab
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At the conference, A*STAR, in collaboration with European-based semiconductor manufacturer, STMicroelectronics and Japanese-based vacuum solution provider, ULVAS, have also announced a 200 millimetre R&D and manufacturing line in Singapore that is focused on piezoelectric micro-electro-mechanical systems (piezoMEMS) technology.
The launch is the second phase of the companies’ ‘Lab-in-Fab’ initiative, which combines STMicroelectronics’ expertise in piezoMEMS R&D and wafer manufacturing, ULVAC’s advanced manufacturing equipment, and A*STAR’s expertise in piezoelectric thin film materials and device design.
To date, Lab-in-Fab has commercialised new lead-free piezoelectric materials and device platforms, as well as creating employment opportunities in Singapore.
One key achievement of phase one was the development of a piezoMEMS transducer platform using physical vapour deposited lead zirconate titanate (PVD PZT) thin film.
A*STAR points out that this is easier to manufacture compared to the conventional sol-gel method of depositing PZT thin films, and reduces lead content by 99% versus traditional ceramic PZT transducers, resulting in a more environmentally friendly option.
Beyond technology development, Lab-in-Fab phase one also introduced a multi-wafer project (MPW) service for local and international universities and institutes, enabling new innovations for piezoMEMS devices and applications.
MOUs
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A*STAR will also be announcing memoranda of understanding (MOUs) with companies over the three-day period to drive collaboration across the industry.
One such example is the agreement with the US-based Nasdaq-listed semiconductor manufacturer GlobalFoundries, whose Singapore site comprises both 200 millimetre and 300 millimetre wafer manufacturing facilities
Under the MOU, A*STAR will provide GlobalFoundries with access to its R&D facilities, capabilities and technical support, while the latter will provide critical equipment to A*STAR to further its R&D efforts.
The collaboration aims to accelerate GlobalFoundries’ development and ramping up of its advanced packaging solutions to provide customers with what the company calls a one-stop solution for semiconductor chips to be manufactured, processed, packaged and tested at its Singapore manufacturing facility.
“As Singapore strengthens its position as a critical node in the global semiconductor supply chain, continued R&D collaboration between public research and the industry is essential to drive innovation and maintain our competitive edge,” says Terence Gan, executive director, A*STAR IME.
Tan Yew Kong, senior vice president and general manager, GlobalFoundries Singapore, says: “Our partnership with A*STAR marks yet another milestone for GF in Singapore, as we continue to play our part in growing local capabilities and talent.”
He adds: “Advanced packaging is not the only partnership that we are talking about, there are other R&D functions that we can explore together with A*STAR. Therefore, this is not the only thing that we are doing today, we are getting closer and there will be more possibilities of partnerships in other R&D work as well.”
