The bonds, which will be listed on the SGX-ST, will mature in 2026.
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The upsized offering comprises a final public offer size of $250 million for retail investors, $150 million more than the initial public offer size.
The final placement size of $250 million for institutional, accredited and other specified investors remains the same.
On Nov 22, Temasek announced that its retail tranche of $100 million drew total valid applications amounting to $649.5 million, about 2.6 times based on the final public offer size of $250 million, or 6.5 times the initial public offer size of $100 million.
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See also: Temasek's bond offering with $100 mil retail tranche drew $649.5 mil in total application
The bond is expected to be issued on Nov 24 and commence trading on the SGX-ST Mainboard at 9am on Nov 25.
The SGX-ST stock code for the bonds will be TEMB.
Photo: Bloomberg
